Verkauf durch Sack Fachmedien

Acharyya / Sarkar / Aleksandrova

Next-Generation High-Speed Electronics and Optoelectronics

Volume 3

Medium: Buch
ISBN: 978-3-032-36894-2
Verlag: Springer
Erscheinungstermin: 29.12.2026
vorbestellbar, Erscheinungstermin ca. Dezember 2026

The book presents latest innovations enabling ultrafast, energy-efficient, and reliable technologies across electronic and photonic domains. The book advances beyond the foundations of previous volumes by integrating developments in wide- and ultra-wide-bandgap semiconductors, two-dimensional materials, ferroelectrics, and spintronics with novel device architectures including HEMTs, nanosheet and fork sheet FETs, TFETs, NC-FETs, and in-memory computing systems. Circuit-level topics encompass nanosheet-based RF building blocks, photonic–electronic hybrids, fault-tolerant VLSI, and advanced interconnects. Emphasis is also placed on terahertz and photonic frontiers, highlighting high-capacity communication, imaging, and quantum technologies. Application-driven perspectives include MEMS–AI healthcare platforms, stress hormone and dopamine biosensors, photovoltaic forecasting, and wide-bandgap devices for electric vehicles and smart grids. With contributions from international experts, the volume addresses both fundamental principles and real-world applications, serving as a valuable reference for graduate students, researchers, and professionals seeking insights into the future of high-speed electronics and optoelectronics.


Produkteigenschaften


  • Artikelnummer: 9783032368942
  • Medium: Buch
  • ISBN: 978-3-032-36894-2
  • Verlag: Springer
  • Erscheinungstermin: 29.12.2026
  • Sprache(n): Englisch
  • Auflage: Erscheinungsjahr 2026
  • Serie: Lecture Notes in Electrical Engineering
  • Produktform: Gebunden
  • Seiten: 600
  • Format (B x H): 155 x 235 mm
  • Ausgabetyp: Kein, Unbekannt
Autoren/Hrsg.

Herausgeber

Introduction to Next-Generation High-Speed Electronics and Optoelectronics.- A Journey from Silicon Technology to Carbon Derivatives.- SiC Power Devices: From Fundamentals to Applications.- Terahertz, Millimeter-Wave, and Infrared Technologies: Design Issues and Challenges.- VLSI-Oriented Terahertz Measurement Systems: Techniques and Applications.