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Three-Dimensional Integrated Circuit Layout

Medium: Buch
ISBN: 978-0-521-11816-3
Verlag: Cambridge University Press
Erscheinungstermin: 22.04.2009
Lieferfrist: bis zu 10 Tage

First published in 1991, this thesis concentrates upon the design of three-dimensional, rather than the traditional two-dimensional, circuits. The theory behind such circuits is presented in detail, together with experimental results. Winner of the Distinguished Dissertation in Computer Science award, this work will prove invaluable to both designers and hardware engineers involved in the development of practical three-dimensional integrated circuits.


Produkteigenschaften


  • Artikelnummer: 9780521118163
  • Medium: Buch
  • ISBN: 978-0-521-11816-3
  • Verlag: Cambridge University Press
  • Erscheinungstermin: 22.04.2009
  • Sprache(n): Englisch
  • Auflage: Erscheinungsjahr 2009
  • Serie: Distinguished Dissertations in Computer Science
  • Produktform: Kartoniert, Paperback
  • Gewicht: 422 g
  • Seiten: 240
  • Format (B x H x T): 170 x 244 x 13 mm
  • Ausgabetyp: Kein, Unbekannt
Autoren/Hrsg.

Autoren

Introduction; 1. Two-dimensional chip design; 2. Three-dimensional chip technology; 3. Three-dimensional circuit topology; 4. Three-dimensional cell tesselation; 5. Three-dimensional abutment system; 6. Abutment system configuration; 7. Abutment system evaluation; Conclusions; Appendices; Index.