McPherson - Reliability Physics and Engineering

Reliability Physics and Engineering

Time-To-Failure Modeling

Medium: Buch

ISBN: 978-3-319-03329-7

Verlag: Palgrave Macmillan

Erscheinungstermin: 09.07.2015

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1 Introduction
2 Materials and Device Degradation
2.1 Material/Device Parameter Degradation Modeling
2.1.1 Material/Device Parameter Decreases With Time
2.1.2 Material/Device Parameter Increases With Time
2.2 General Time-Dependent Degradation Models
2.3 Degradation Rate Modeling
2.4 Delays in the Start of Degradation
2.5 Competing Degradation Mechanisms
3 From Material/Device Degradation to Time-To-Failure

3.1 Time-To-Failure
3.2 Time-To-Failure Kinetics
4 Time-To-Failure Modeling

4.1 Flux-Divergence Impact on Time-To-Failure
4.2 Stress Dependence and Activation Energy
4.3 Conservative Time-To-Failure Models

4.4 Time-To-Failure Modeling Under High Stress

References

5 Gaussian Statistics – An Overview

5.1 Normal Distribution
5.2 Probability Density Function
5.3 Statistical Process Control
References
6 Time-To-Failure Statistics
6.1 Lognormal Probability Density Function
6.2 Weibull Probability Density Function
6.3 Multimodal Distributions
6.3.1 Multimodal Distribution (Separated In Time)
6.3.2 Mixed Multiple Failure Mechanisms
References
7 Failure Rate Modeling
7.1 Device Failure Rate

7.2 Average Failure Rate
7.2.1 Lognormal Average Failure Rate
7.2.2 Weibull Average Failure Rate
7.3 Instantaneous Failure Rate
7.3.1 Lognormal Instantaneous Failure Rate
7.3.2 Weibull Instantaneous Failure Rate

7.4 Bathtub Curve
7.5 Failure Rate for Electronic Devices
References

8 Accelerated Degradation
8.1 Metastable States
8.2 Impact of Temperature on Degradation Rate
8.3 Free-Energy of Activation

8.4 Impact of Stress and Temperature on Degradation Rate

8.4.1 Real Versus Virtual Stresses
8.4.2 Impact of Stress on Materials/Devices
8.5 Accelerated Degradation Rates
References
9 Acceleration Factor Modeling
9.1 Acceleration Factor

9.2 Power-Law Versus Exponential Acceleration

9.3 Cautions Associated with Accelerated Testing

9.4 Conservative Acceleration Factors

References
10 Ramp-To-Failure Testing

10.1 Ramp-To-Failure Testing

10.2 Linear Ramp-Rate
10.2.1 Linear Ramp with Exponential Acceleration
10.2.2 Linear Ramp with Power-Law Acceleration
10.3 Breakdown/Rupture Distributions

10.4 Cautions Associated With Ramp-To-Failure Testing
10.5 Transforming Breakdown/Rupture Distributions Into Constant-Stress Time-To-Failure Distributions
10.5.1 Transforming Breakdown/Rupture Distribution Time-To-Failure Distribution Using Exponential Acceleration
10.5.2 Transforming Breakdown/Rupture Distribution to Time-To-Failure Distribution Using Power-Law Acceleration
10.6 Constant-Stress Lognormal Time-To-Failure Distributions From Ramp Breakdown/Rupture Data
10.6.1 Exponential Acceleration
10.6.2 Power-Law Acceleration

10.7 Constant-Stress Weibull Time-To-Failure Distributions From Ramp Breakdown/Rupture Data

10.7.1 Exponential Acceleration
10.7.2 Power-Law Acceleration

References
11 Time-To-Failure Models for Selected Failure Mechanisms in Integrated Circuits
11.1 Electromigration (EM)
11.2 Stress Migration (SM)
11.2.1 SM in Aluminum Interconnects
11.2.2 SM in Copper Interconnects
11.3 Corrosion

11.3.1 Exponential Reciprocal-Humidity Model
11.3.2 Power-Law Humidity Model
11.3.3 Exponential Humidity Model

11.4 Thermal-Cycling/Fatigue Issues
11.5 Time-Dependent Dielectric Breakdown (TDDB)
11.5.1 Exponential E-Model
11.5.2 Exponential 1/E – Model
11.5.3 Power-Law Voltage V-Model
11.5.4 Exponential - Model
11.5.5 Which TDDB Model to Use
11.5.6 Complementary Electric-Field and Current-Models
11.6 Mobile-Ions/Surface-Inversion
11.7 Hot-Carrier Injection (HCI)
11.8 Negative-Bias Temperature Instability (NBTI)
References
12 Time-To-Failure Models for Selected Failure Mechanisms In Mechanical Engineering

12.1 Molecular Bonding in Materials
12.2 Origin of Mechanical Stresses in Materials
12.3 Elastic Behavior of Materials

12.4 Inelastic/Plastic Behavior of Materials
12.5 Important Defects Influencing Material Properties

12.5.1 Vacancies
12.5.2 Dislocations

12.5.3 Grain Boundaries

12.6 Fracture Strength of Materials
12.7 Stress Relief in Materials
12.8 Creep-Induced Failures
12.8.1 Creep Under Constant-Load/Stress Conditions
12.8.2 Creep Under Constant-Strain Conditions

12.9 Crack-Induced Failures
12.9.1 Stress Raisers/Risers at Crack Tips
12.9.2 Strain-Energy Release Rate
12.9.3 Fast Fracture/Rupture
12.10 Fatigue-Induced Failures
12.10.1 Fatigue for Materials (No Pre-Existing Cracks)
12.10.2 Low-Cycle Fatigue
12.10.3 High-Cycle Fatigue
12.10.4 Fatigue for Materials (With Pre-Existing Cracks)
12.11 Adhesion Failures

12.12 Thermal-Expansion Induced Failures
12.12.1 Thermal Expansion
12.12.2 Constrained Thermal Expansion
12.12.3 Thermal-Expansion Mismatch

12.12.4 Thin Films on Thick Substrates
12.13 Corrosion-Induced Failures
12.13.1 Dry Oxidation
12.13.2 Wet Oxidation
12.13.3 Impact of Stress on Corrosion Rates
References
13 Conversion of Dynamical Stresses Into Effective Static Values
13.1 Effective Static-Stress Equivalent Values
13.2 Effective Static-Stress Equivalent Values When Using Power-Law TF Models
13.3 Effective Static-Stress Equivalent Values When Using Exponential TF Models
13.4 Conversion Of A Dynamical Stress Pulse Into A Rectangular Stress Pulse Equivalent
13.4.1 Effective Rectangular Pulse Stress-Equivalent Values for Power-Law TF Models
13.4.2 Effective Rectangular Pulse Stress-Equivalent for Exponential TF Models
13.4.3 Numerical Integration
13.5 Effective Static-Temperature Equivalents

13.6 Mission Profiles
13.7 Avoidance of Resonant Frequencies

14 Increasing the Reliability of Device/Product Designs

14.1 Reliability Enhancement Factor

14.2 Electromigration Design Considerations

14.3 TDDB Design Considerations

14.4 NBTI Design Considerations

14.5 HCI Design Considerations

14.6 Surface Inversion Design Considerations
14.7 Creep Design Considerations
14.7.1 Creep in Rotors
14.7.2 Creep in Pressurized Vessels
14.7.3 Creep in Leaf Springs
14.7.4 Stress Relaxation in Clamps/Fasteners

14.8 Fatigue Design Considerations
14.8.1 Fatigue in Storage Vessels
14.8.2 Fatigue in Integrated Circuits

15 Screening
15.1 Breakdown/Strength Distribution f

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