Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis.
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.
Produkteigenschaften
- Artikelnummer: 9781461349891
- Medium: Buch
- ISBN: 978-1-4613-4989-1
- Verlag: Springer US
- Erscheinungstermin: 14.10.2012
- Sprache(n): Englisch
- Auflage: Softcover Nachdruck of the original 1. Auflage 2003
- Serie: The Springer International Series in Engineering and Computer Science
- Produktform: Kartoniert
- Gewicht: 324 g
- Seiten: 185
- Format (B x H x T): 155 x 235 x 12 mm
- Ausgabetyp: Kein, Unbekannt